ELECTRONIC ANALYSIS OF PCB PIPES
objective of this project is to scan the printed circuit board to perform analysis fluid dynamics (CFD). PCB has been cooled very well; However, heat dissipation is not optimal because the problems that arise are premature aging caused by long-term combination errors when used.
3D scanning has been achieved with Go! SCAN20's Creaform and reverse design are made with CATIA. The model has been published 3D drawing and coolant flow through the shell was simulated using the conjugate heat transfer method. This method has found that the important areas of stagnant air around the particular capacitor will generate high temperatures outside the operating temperature range of the main components.
3D Scan 3D circuit! SCAN20
Reverse design of 3D drawing board PCB circuit
analysis CFD analysis
Set boundary conditions
Results of analysis for optimal adjustment of circuit board PCB